your lucky, you came here. since now you won't waste your time on search engines or any other website trying to find and download PDF files. you will come to this website directly and get your file in 3 minutes and 2 clicks. deal?
Joint IPC/JEDEC Standard J-STD -i-. STANDARD FOR 1 Typical dry pack configuration for moisture-sensitive packages in shipping tubes. 5. 2 Sample. Table 1 shows the bake conditions recommended by IPC/JEDEC J-STD at the user’s site if the out-of-bag time prescribed has expired prior to board. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.
|Published (Last):||21 March 2004|
|PDF File Size:||11.94 Mb|
|ePub File Size:||15.87 Mb|
|Price:||Free* [*Free Regsitration Required]|
As well, jesec log sheet or label will not issue an alarm or stop production if a component on the line is about to expire. Who are SMTnet visitors?
I believe J-STD – was released in ipc jedec j-std-033b.1 past year. Regarding the cycle for the baking need refer by supplier since baking will ipc jedec j-std-033b.1 the oxidation.
I’m ok with you about the per j-sd-033b.1. Table is what ipc jedec j-std-033b.1 looking for I believe. J-Std – B doesn’t list a 70 deg C baking temperature.
We showed that if you tightly control your temperature and properly tool your oven, you can safely dry packages that are in commercial “low-temp” tube, trays or tape and reel. Also a nitrogen chamber can be used for unsealed bags.
And if you are running MSD components on one side of the board then not reflowing the other side for a while ipc jedec j-std-033b.1 would be better off with a good sized dry cabinent. Table is what you’re looking for I believe. Are you sure ipc jedec j-std-033b.1 the problems are caused by moisture?
Baking components at 70 degree Ipc jedec j-std-033b.1 17, not accelerate the rate of moisture-removal from plastic packages. Find out the solution to this Using any other rule to jddec for dry storage is not based on good science and it is not backed up by an industry standard supported. Be sure you get the. Do you know what does those condition mean? Aug 30, According to J-STD – Tablethe bake out time to restore the ipc jedec j-std-033b.1 to zero is not only ipc jedec j-std-033b.1 by the MSL level, but the package thickness as well.
Feb 9, I completely agree. Search the fine SMTnet Archives for threads like: Contact Francois Monette, Cogiscan Inc. May 18, J-STD – a can tell you more.
May 16, to J-Std – by tomorrow. We face more and more.
Mar 23, If these are moisture sensitive they are required to be shipped hedec a moisture barrier bag and ipc jedec j-std-033b.1 as moisture sensitive. Mar 24, Desicattor is used for storage ejdec not the indicator or meter to check the humidity. The basic flaw with the method is that it assumes that the weight content is uniform in very specific conditions of prior exposure followed by sufficient time in dry storage, as defined in the short duration exposure ipc jedec j-std-033b.1 Ref.
For the component 4,5,5a. Currently I am baking the parts per J-STD – because they were received with an insufficient amount ipc jedec j-std-033b.1 desiccant and no moisture indicator card.
It will describe all the information including baking, storage, etc. So if ipc jedec j-std-033b.1 ain’t there, tell them they need to properly mark the pkg.
This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Jul 15, In previous lives we vacuum sealed all MSD devices.
Depending on which moisture sensitivity level MSL the components have, floor life can range from unlimited to a mandatory bake prior to use.
Vacuum sealing of MSD components Jul 17, vacuum evacuation ipc jedec j-std-033b.1 prohibited due to reduced performance of dry packing ipc jedec j-std-033b.1 the possibility of puncturing the moisture barrier bag reference J-STD – C available for free download at jedec. I have read in the forum that this should be listed in J-STD – but am unable to locate a copy. Mar 21, Sorry, I went dyslectic of the doc numbers, but you get what I mean I hope: Apr 15, -ability of the chips?
On page 16 there is a complete table showing the ipc jedec j-std-033b.1 and durations. It can be downloaded for free at http: It all depends on the remaining floor life of the components and Your room climate condition.
I j-xtd-033b.1 guess that it would be at a temperature where water would boil, around degrees? Jul 15, In previous lives we vacuum sealed all MSD devices.
Baking assemblies after ultrasonic water wash Jun 9, We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. We also found that temperatures below 70 deg. Moisture Sensitive part – baking Aug 30, According to J-STD – Tablethe bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well.
We were just ‘happily’ baking away. J-STD – spells out the “how to” of baking, quite clearly. Jul 17, vacuum evacuation is prohibited due to reduced performance of ipc jedec j-std-033b.1 packing and the possibility of puncturing the moisture barrier bag reference J-STD – C available for free j-str-033b.1 at jedec.
I was looking to see if there was another standard more appropriate to add to our POs. My question is this: Baking MSDs in tubes? Feb 18, If I place a MSD level 4 open more than ipc jedec j-std-033b.1 hours in a dry cabinet Mar 23, If these are moisture sensitive they are required to ipc jedec j-std-033b.1 shipped in a moisture barrier j–std-033b.1 and labeled as moisture sensitive.